Section 675IAC14-4.3-251.5. Section E4104.3; methods of bonding

  5. (a) In the first sentence of Section E4104.3, delete "eliminate" and substitute "reduce".

  (b) Delete the title and text of Section E4104.3, item 1, and substitute to read as follows: 1. Equipotential Bonding Grid. The parts specified in Section E4104.1 above shall be connected to an equipotential bonding grid with a solid copper conductor, insulated, covered, or bare, not smaller than 8 AWG or rigid metal conduit of brass or other identified corrosion-resistant metal conduit. Connections shall be made by exothermic welding or by listed pressure connectors or clamps that are labeled as being suitable for the purpose and are of stainless steel, brass, copper, or copper alloy. The equipotential bonding grid shall conform to the contours of the pool and shall extend within concrete or under other conductive paved, or under unpaved walking surfaces for 3 feet (914 mm) horizontally beyond the inside walls of the pool and shall be permitted to be any of the following:

1.1 Structural Reinforcing Steel. The structural reinforcing within a concrete pool shell or deck. Where deck reinforcing steel is not an integral part of the pool and its reinforcing, the deck reinforcing steel shall be bonded to other parts of the bonding grid at a minimum of four points uniformly spaced around the pool perimeter using a minimum 8 AWG solid copper conductor. Reinforcing steel shall not extend into soil beyond the concrete envelope.

1.2 Bolted or Welded Metal Pools. The wall of a bolted or welded metal pool.

1.3 Alternate Means. This system shall be permitted to be constructed as specified in (i) through (iii):

(i) Materials and Connections. The grid shall be constructed of minimum 8 AWG bare solid copper conductors. Conductors shall be bonded to each other at all points of crossing. Connections shall be made in accordance with item 1 above.

(ii) Grid Structure. The grid shall be arranged in a perpendicular grid pattern with 12 inches (305 mm) between conductors with tolerance of 4 inches (102 mm).

(iii) Securing. The grid shall be secured within concrete pool and deck material or under other conductive pool and deck material.

Exception: The equipotential bonding grid shall not be required to be installed under the bottom of or vertically along the walls of vinyl lined polymer wall, fiberglass composite, or other pools constructed of nonconductive materials. The equipotential bonding grid shall not be required to be installed under pool decks of nonconductive materials. Any metal parts of the pool, including metal structural supports, shall be bonded in accordance with E4104.1. For the purposes of this section, poured concrete, pneumatically applied (sprayed) concrete, and concrete block, with painted or plastered coatings, shall be considered conductive material. Asphalt, flagstone, brick, tile, and concrete pavers are examples of conductive deck paving materials.

(Fire Prevention and Building Safety Commission; 675 IAC 14-4.3-251.5; filed Mar 6, 2008, 11:13 a.m.: 20080402-IR-675070483FRA; readopted filed Aug 4, 2011, 8:35 a.m.: 20110831-IR-675110254RFA)